GE-FANUC DS3800HSCG Circuit Board: Advanced High-Level Isolator Module

Material:High-grade copper-clad laminate

Chip Count:Up to 1000 integrated circuits

Operating Temperature:-40°C to +85°C

Power Consumption:15W (typical)

Connectivity:RS-232, RS-485, Analog I/O

Certifications:CE, UL, FCC

    Integrating cutting-edge technology, the GE DS3800HSCG Circuit Board is designed to enhance system reliability and efficiency.

    The components on this board are meticulously labeled, facilitating easy identification and maintenance.

    This board features robust insulation properties, making it ideal for environments with high electromagnetic interference.

    Equipped with GE‘s advanced circuitry, the DS3800HSCG ensures precise signal processing and data transmission, critical for accurate control in industrial processes.

    With its compact yet durable design, the DS3800HSCG is optimized for space-saving installations without compromising performance.

    Backed by comprehensive technical support, users gain access to detailed documentation and expert assistance for optimal system integration and troubleshooting.